Microelectronics Projects

Fluor recently completed the second phase of Analog Devices' Assembly/Test Facilities in Asia. The first phase of the project was a 14,400-square-meter Assembly/Test facility featuring front of line device manufacturing and test that was completed by Fluor in June 1997.

• This recently completed phase is a new three-level main production building with a basement and elevated corridor link to the first-phase facilities, providing an additional 21,300-square-meters for new semiconductor assembly/test space.
• The main building includes 8,640 square meters of Class 10,000 and 100,000 cleanrooms.
• A new 1,320-square-meter central utility plant located in a separate building provides all of the required utilities needed to support the main building's production requirements including chilled and treated water, compressed air, vacuum, process cooling water, liquid nitrogen supply, and all electrical power including emergency generators.
• Other new spaces include cleanroom lockers and gowning areas, failure analysis laboratories, engineering offices, loading docks, uninterruptable power supply, kitchen, cafeteria, and general administrative offices.
• This project was designed and constructed by Fluor based on an EPCM delivery platform using resources from Tucson, Arizona and Manila, the Philippines. This effort started with a FOCUSSM work session and continued with a Concept Design Report (CDR) providing a fixed-price basis.
• The project reached 3,200,000 safe work hours with a recordable incident rate of only 0.13. Sixteen local subcontractors were used in the construction of the facility and the craft staff level peaked in August 2000 with over 1,500 craft workers on site.

Fluor provided engineering, procurement, and construction management services for SilTerra Malaysia Sdn. Bhd., a dedicated wafer foundry built from a greenfield site and winner of the 2002 Top Fab Award.

• The massive 472,000-square-foot facility includes a state-of-the-art, 125,000-square-foot manufacturing area; a 5,000 square-foot Class 1 cleanroom for reticle and wafer start; a 95,000 square-foot ballroom-style, Class 100 manufacturing area; a 10,000 square-foot Class 1000 support room; and a 15,000 square-foot Class 100,000 area for e-test, wafer sort and backgrind.
• In a record 18 months, SilTerra completed construction, equipment installation and 0.25 µm process qualification, and produced the first yielding product wafer on December 22, 2000.
• The company introduced both 0.22 and 0.18 µm processes within the next seven months. In addition, SilTerra was awarded ISO 9002 certification in June 2001, only months after operation began.
• SilTerra is developing a 0.13 µm CMOS process that will use the latest tools and materials. These include 193 nm DUV scanners for its lithography process, high-aspect-ratio etch, dual-damascene copper and low-k dielectrics for intermetal barrier layers.
• The facility is a highly automated, fully integrated 200mm wafer fabrication plant. It produces advanced CMOS technologies with up to 33 masking levels.
• The facility provides foundry services for logic, mixed-signal, memory and high-voltage products using 0.25, 0.22 and 0.18 µm technologies. Low-power options for these processes are also available.

Fluor provided construction management services for the world-class semiconductor facility. The facility was constructed in just over 18 months and consisted of two fab modules totaling approximately 160,000 square feet of class 1 cleanroom.

• While the massive scope of the project is notable, an extremely aggressive timetable makes the effort even more remarkable.
• Phase 1 involved the construction of a new, three-story manufacturing and fabrication facility with support areas, totaling approximately 600,000 square feet.
• The site master plan allows for future buildings on the campus, represented by Phases 2 and 3.
• Fluor provided construction management services, including procurement, tool hook-up and building commissioning.

Fluor provided engineering design and construction administration services from the Tucson, Arizona office and on-site support for the clients new, stand-alone Mask Shop Building, designed to support its ever-broadening product line of advanced semiconductor solutions.

• With a footprint of approximately 70,000 square feet, the two-story structure includes a 14,000-square-foot subfab with a Class 1@.1 cleanroom -- with provisions for an 8,000-square-foot expansion in the future.
• Cost was the primary driver on the project. The final total installed cost (TIC) is within 3 percent of the project's initial goal. The 17-month basebuild completion also fulfilled Micron's goal of producing glass masks by the first quarter of 2003.